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Soeteck Room Level CDU for AI Data Center Solutions

Soeteck Room Level CDU for AI Data Center Solutions

Soeteck Room Level CDU for AI Data Center Solutions

 

Soeteck Room CDU for AI Data Center Solutions serves as a reliable core element of liquid cooling systems for large-scale liquid-cooled data centers, HPC clusters, and AIDC training scenarios. It is well-suited for installations with over 100 cabinets and intensive CPU/GPU workloads, delivering dedicated coolant distribution. With a cooling capacity ranging from 200kW to 2000kW, it features N+1 redundant pumps and leak detection, supports online coolant servicing, and provides remote management via Modbus/BACnet protocols for streamlined operations.
Cooling Capacity 800/1000/1350/2000 kW
Inlet Flow Rate 69.04-173.73 m³/h
Outlet Flow Rate 72.84-190.78 m³/h
Rated Power 15.5/18.5/22.5/33.0 kW
Fluid Type Water / 25% EG
W*D*H 980*1480*2000 mm
Full Seriews Products of High-density Cooling Solution
 

Soeteck Full Range of High-Density Cooling Solutions

On-Stop Provider for your Swift Critical Cooling Deployment Needs 

Features

  • Room-Level Liquid Cooling Solution

    High Cooling Capacity & Wide Adaptability

    Provides 200kW-1600kW cooling capacity, suitable for AIDC, medium-to-large data centers, HPC clusters, and large-scale GPU-accelerated training environments.

    High System Reliability & Online Maintenance

    Features N+1 redundant pumps, multi-stage filtration, and independent thermal monitoring to maintain uninterrupted cooling during maintenance or component failures; real-time water quality tracking allows online heat exchanger swaps.

    Smart Remote Management

    Supports Modbus and BACnet protocols for remote monitoring, fault notification, and performance tuning.

Advantages

🏢

Large-Scale Deployment & High Reliability

Supports 100+ cooling cabinets, N+1 redundancy ensures stable operation for critical scenarios like HPC and AI training.

🔧

Full-Scenario Adaptation & Efficient O&M

Online maintenance minimizes downtime; smart protocols enable remote management, reducing operational complexity and costs.

High Performance & Energy Efficiency

High cooling density meets the needs of GPU clusters and AI training; optimized design reduces energy consumption for large-scale deployments.

🔄

Flexible Expansion & Compatibility

Scalable architecture adapts to growing data center demands; compatible with mainstream industrial communication protocols for seamless integration.

Parameters

Model SY-CDU-RM-900 SY-CDU-RM-1000 SY-CDU-RM-1350 SY-CDU-RM-2000
Capacity  800kW 1000kW 1350kW 2000kW
Primary Side
Circulating Medium Cooling Water
Inlet/Outlet Design Temperature 35/45℃
Circulating Flow Rate  69.04m³/h 86.31m³/h 117.78m³/h 173.73m³/h
Interface Size φ114.3*2.0mm φ114.3*2.0mm φ133*3.0mm φ159*3.0mm
Water Pressure Drop ≤120KPa
Secondary Side
Circulating Medium 25% EG
Inlet/Outlet Design Temperature  50/40℃
Outlet Temperature Range  35-50℃
Available Head ≥120KPa
Circulating Flow Rate  72.84m³/h 91.05 122.92 190.78
Number of Pumps 2 3 3 3
Interface Size φ114.3*2.0mm φ114.3*2.0mm φ133*2.0mm φ159*3.0mm
Rated Power 15.5kW 18.5kW 22.5kW 33.0kW
Net Weight 850kg 1000kg 1200kg 1500kg
Overall Dimensions WDH  980*1480*2000mm

LIQUID COOLING SYSTEM ARCHITECTURE DIAGRAMS

Soeteck delivers a full-chain cold plate liquid cooling solution, highlighting high-efficiency heat exchange, intelligent operation and maintenance, and outstanding reliability. The solution encompasses liquid cooling cabinets, cold plates, secondary loops, CDU, dry coolers, and cooling towers. Beyond core products, we offer reliable OEM/ODM customization, fast delivery, a professional technical team, hassle-free after-sales support, and remote technical assistance.

Liquid Cooling System Architecture

FEATURED PRODUCTS OF HIGH-DENSITY COOLING SOLUTIONS

Focus on the core cooling demands of high-density data center deployments, where our full range of premium products leverages advanced technological advantages to reliably safeguard continuous, efficient, and stable operation.

1-80 kW

Cold Plate Cooling

High thermal conductivity, compact footprint, direct heat transfer, ideal for high-power electronic components.

10-80 kW

Immersion Cooling

Uniform temperature control, zero dust intrusion, ideal for high-density data centers & supercomputers.

21.2-31.1 kW

Rear Door Heat Exchanger

No server room reconstruction, high heat rejection efficiency, plug-and-play installation, fits existing rack infrastructure.

20-1600 kW

Fanwall System

Redundant fan design, low noise level, adjustable airflow, perfect for data centers & industrial cooling facilities.

Application

• Computer Room and Data Center (IDC)

• Switch Room and Mobile Communication Room

• High-Tech Environment and Precision Laboratory

• Industrial Control Room and Precision Machining Equipment

• Standard Testing Room and Calibration Center

• UPS and Battery Room

• Biochemical Culture Room

• Hospitals and Medical Testing Rooms

Application scenarios

Solutions

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